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These components, which include a range of sensors, actuators, and control units, are designed to optimize performance, enhance energy efficiency, and ensure reliability.
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The COB assembly process involves directly bonding a semiconductor chip to a substrate, allowing for enhanced thermal management and increased circuit density.
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COB enables the creation of reusable software components that can be utilized across different programming languages, thereby enhancing interoperability and reducing development time.
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With wavelengths ranging from 100 to 280 nanometers, UVC radiation is effective in inactivating microorganisms such as bacteria, viruses, and fungi.
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It plays a significant role in both natural and artificial light sources.
2025-06-30